Taiwan Semiconductor Manufacturing Co, known as TSMC, is set to build two more advanced chip packaging facilities at the Chiayi Science Park in southern Taiwan, according to the island’s science and technology minister.
The Chiayi Science Park is already being developed as a major hub for TSMC’s advanced chip packaging operations. The company’s first packaging plant at the site has already reached full-scale production, and a second facility is expected to follow suit in the near future.
National Science and Technology Council Minister Wu Cheng-wen made the announcement Sunday during a groundbreaking ceremony for the next phase of development. “Today’s groundbreaking marks the start of the second phase, which will include a third and fourth plant,” Wu said.
The minister added that once all four plants are fully operational, the park is projected to produce more than 300 billion Taiwan dollars — roughly $9.35 billion — in annual output and support more than 9,000 jobs.
TSMC has been aggressively scaling up its advanced chip packaging capacity, including its chip-on-wafer-on-substrate technology. The push is being driven by surging demand from artificial intelligence chip designers such as Nvidia, where current supply has struggled to keep pace with what customers need.
