Taiwan-based semiconductor company MediaTek has brought aboard Douglas Yu, a veteran executive from Taiwan Semiconductor Manufacturing Company (TSMC), to serve as a part-time consultant as the firm accelerates its artificial intelligence chip initiatives.
The appointment comes as MediaTek intensifies efforts to expand its presence in the rapidly growing AI processor market through enhanced packaging capabilities.
Yu brings more than three decades of experience from TSMC, where he began working in 1994 before retiring in 2025. Throughout his career, he held various positions in backend research and development and was instrumental in creating TSMC’s cutting-edge packaging solutions, particularly the CoWoS (Chip on Wafer on Substrate) technology.
This CoWoS packaging method has become essential for artificial intelligence processors and is extensively utilized in Nvidia’s chip products.
In a Saturday statement, MediaTek expressed enthusiasm about the hiring, saying: “We look forward to leveraging his extensive industry experience and technical expertise to support the company’s exploration and roadmap planning for future advanced packaging technologies, as well as to guide our R&D and investment strategy in advanced packaging-related products and technologies associated with TSMC.”
The demand for TSMC’s CoWoS packaging capabilities has surged, with major clients including Nvidia and various cloud computing companies competing to secure production capacity.
MediaTek recently announced projections that its AI accelerator ASIC chip business will generate revenue in the multiple billions of dollars by 2027.
