BE Semiconductor Industries announced Thursday that its quarterly orders more than doubled compared to the same period last year, driven by robust growth across all business segments and exceptionally strong interest in hybrid bonding technology.
The semiconductor equipment manufacturer has captured investor attention with its hybrid bonding capabilities, which enable direct stacking of computer chips. This cutting-edge approach has positioned the company as an early leader as artificial intelligence applications create unprecedented demand for advanced semiconductor solutions.
The company’s order bookings, a key metric for predicting future performance, surged 104.5% to reach 269.7 million euros ($315.5 million) during the first quarter, a dramatic increase from the previous year’s 131.9 million euros.
“Favorable order trends in Q1 reflect the strength of Besi’s advanced packaging market position for next generation AI applications,” CEO Richard Blickman said in a statement.
The artificial intelligence investment wave has helped compensate for sluggish performance in automotive, personal computer, and memory chip sectors.
Other semiconductor industry players, including TSMC, ASML, and ASM International, have also reported strong results recently, indicating the entire sector continues to capitalize on the artificial intelligence chip demand explosion.
Looking ahead, BESI projected second-quarter revenue growth of 30% to 40% compared to the first quarter’s 184.9 million euros in 2026.
