American technology company Intel and 3DGS Inc. USA announced Friday their plan to invest approximately $3.3 billion in establishing a substrate manufacturing facility in India’s Odisha state, according to the Indian government.
Key details of the investment include:
• The facility is projected to generate more than 1,800 direct high-skilled employment opportunities.
• Substrates serve as the foundation material where semiconductor device components are mounted.
• India’s government has committed billions in subsidies to attract semiconductor facilities and related manufacturing as part of Prime Minister Narendra Modi’s broader initiative to increase domestic production.
• The facility, scheduled for construction in the Bhubaneswar-Khurda area over five to six years, will specialize in advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor technologies.
