Samsung Electronics announced Friday that it has commenced distribution of sample units for its newest high-bandwidth memory technology, the 12-layer HBM4E chip, which the company describes as the industry’s inaugural shipment of this advanced product type.
The technology giant from South Korea reported that this latest chip delivers performance speeds exceeding 20% compared to earlier HBM4 generation products.
According to Samsung, the chip incorporates the company’s newest 1c DRAM process technology, which represents sixth-generation 10-nanometer-class DRAM, combined with Samsung’s 4-nanometer foundry logic base die technology.
The manufacturer had announced in April its intention to deliver initial HBM4E chip samples during the second quarter.
This development follows just three months after Samsung initiated shipments of its HBM4 chips to clients in February, highlighting the company’s push to solidify its standing in the emerging AI memory sector through early distribution of cutting-edge product samples.
Among Samsung’s client base are prominent AI industry leaders including AMD, Nvidia and Google, as market demand continues growing for sophisticated memory chips utilized in AI servers and processing units.
